Preparation of solder powder by ultrasonic atomization

Solder powder is an indispensable connecting material in the electronics industry, mainly used to formulate solder paste for the soldering process of surface mount technology (SMT). The quality of the solder powder directly affects the performance of the solder paste and the welding quality of the circuit board, so the preparation process of the solder powder has high requirements. At present, the commonly used solder powder preparation process has a gas atomization method, rotating disk centrifugal atomization method and ultrasonic atomization method, etc., of which the ultrasonic atomization method has been used to produce high-quality solder powder used for soldering and solder paste, is currently the mainstream of the European and American countries to make the ultra-fine powder process.

The principle of ultrasonic atomization method is the use of ultrasound vibration and cavitation effect, the molten metal droplets in the ultrasonic transducer atomized into tiny droplets, and cooled in the air to solidify into spherical powder particles. The ultrasonic transducer is the core component of the whole system, which converts the high-frequency electrical signal into mechanical vibration of the same frequency, and amplifies its amplitude through the amplifier rod to drive the atomization angle end face for ultrasonic vibration. The molten metal liquid is transported to the top of the atomizing angle through the guide tube, and due to the ultrasonic effect, the metal liquid is broken into tiny droplets and drifts down with the airflow. In the process of falling, the droplets rapidly cool and solidify to form spherical powder particles, which are collected in the powder collecting cylinder.

Figure 1. Principle of ultrasonic atomization method

The characteristics and advantages of the ultrasonic atomization method of preparing solder powder are as follows:

  1. The morphology and size of the powder particles can be controlled, so as to obtain highly spherical, uniform particle size and narrow distribution of the powder.

  2. The purity and oxygen content of the powder particles are low, and in the ultrasonic atomization process, the contact area between the metal liquid and the gas is small, and the degree of oxidation is low, and it can be atomized in an inert atmosphere to further reduce the possibility of oxidation.

  3. Simple equipment and process, convenient operation, stable and controllable product quality.

  4. Small energy consumption, high utilization rate, low cost, environmental protection and energy saving.

Although the ultrasonic atomization process for the production of solder powder has a series of advantages, but the ultrasonic atomization process yield is small, the capacity can not meet the market demand, so manufacturers in the mass production of T6 below the conventional solder powder generally use centrifugal atomization process.

In order to solve the problem of low yield in the production of ultra-fine powder above T6, Shenzhen Fuyinda company independently developed a unique alloy powder preparation technology - liquid phase molding preparation technology, the use of the principle of ultrasonic cavitation effect, the preparation of ultra-fine solder powder above T6, the production of solder powder powder powder not only has a good shape of ultrasonic atomization process has Its production of welding powder powder not only has the advantages of good morphology, uniform and controllable particle size, low oxygen content, etc., but also solves the problem of insufficient production capacity, and has realized large-scale mass production.

Figure 2: Comparison of the morphology of solder powder prepared by liquid phase forming technology and ultrasonic atomization process.

相关推荐
猎板PCB 邹亮2 天前
材料创新与工艺升级——猎板PCB引领高频阻抗板制造革命
制造·pcb工艺
技术流浪者3 天前
PCB设计实践(十二)PCB设计电容选型:功能、材质、规则
硬件工程·材质·pcb工艺
hfdz_00426 天前
USB接口的PCB设计
嵌入式硬件·硬件工程·pcb工艺
农民也会写代码10 天前
厚铜pcb生产厂家哪家好?
制造·pcb工艺·pcb
攻城狮-鹏哥11 天前
DRV8301 三相电机驱动芯片的硬件参数与应用设计
驱动开发·单片机·嵌入式硬件·mcu·硬件架构·dsp开发·pcb工艺
长流小哥13 天前
PCB设计实战技巧宝典:从库管理到布线优化的全流程解析
pcb工艺
猎板阿权17 天前
高可靠性厚铜板制造的关键设备与工艺投入
pcb工艺
农民也会写代码17 天前
国内多层PCB供应商优选指南
制造·pcb工艺
码小文18 天前
Cadence学习笔记之---原理图设计基本操作
笔记·单片机·学习·硬件工程·pcb工艺
猎板阿权19 天前
突破厚铜PCB阻抗控制难题:多级阻抗实现方法
pcb工艺